Light diffusion agent encapsulation adhesive
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LED chip on the job, can't completely exposed to air, for the sake of waterproof, dustproof, and improve the luminous efficiency of the production of LED lamps, must be carried out on the LED chip packaging, the packaging resin is mainly composed of epoxy resin and silicone resin matrix, commonly known as encapsulation adhesive
In early LED potting glue, in addition to epoxy resin and silicone resin, added a diluting agent, wetting agent, viscosifier, pigments, fluorescent powder, such as to improve its performance, now someone will light diffusion agent also join, namely in epoxy resin and silicone resin, before joining mixed curing agent, temperature, adding suitable amount of light diffusion agents joined, a light diffusion potting glue, can make the LED lamps and lanterns is made easier and miniaturization
One-component, a two-component epoxy system, UV system pouring sealant can add light diffusion agent MBX - 15